Built -in mould secondary takes off structure by force

The utility model discloses a built -in mould secondary takes off structure by force, take off the subassembly by force including movable mould board, ejecting subassembly and secondary, being equipped with movable mould benevolence on the movable mould board, being equipped with the ejector pad in...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: OU WENCONG, LIU HUIDONG, LI XIAOMING
Format: Patent
Sprache:chi ; eng
Schlagworte:
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Beschreibung
Zusammenfassung:The utility model discloses a built -in mould secondary takes off structure by force, take off the subassembly by force including movable mould board, ejecting subassembly and secondary, being equipped with movable mould benevolence on the movable mould board, being equipped with the ejector pad in the movable mould benevolence, the needle is inlayed to the movable mould and the needle is inlayedto the back -off, ejecting subassembly passes through the push rod and is connected with the ejector pad, the secondary takes off the structure by force and includes buckle mold insert and movable insert, the one end and the ejecting subassembly of buckle mold insert are connected, and the other end is equipped with the spout, and the spout forms the opening on the side of buckle mold insert, andmovable insert slides in the spout, as buckle mold insert from initial position when moving along, movable insert protrusion in opening, and promote the back -off and inlay the needle and move along,after the certain distance