High density pliability contact high reliability circuit board

The utility model discloses a high density pliability contact high reliability circuit board, including flexible line way board main part, golden finger and reinforcement piece, flexible line way board main part includes the PI substrate, go up the copper foil layer, lower copper foil layer, it cove...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: HUANG BAIHAN, LAN GUOFAN, ZUO LIXIONG
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The utility model discloses a high density pliability contact high reliability circuit board, including flexible line way board main part, golden finger and reinforcement piece, flexible line way board main part includes the PI substrate, go up the copper foil layer, lower copper foil layer, it covers the membrane under with to coat the epiphragma, it all includes circuit copper foil and ground connection copper foil to go up copper foil layer and lower copper foil layer, be equipped with the PTH hole on the circuit copper foil of last copper foil layer, the golden finger through the PTH holewith other each layer link to each other and the golden finger exposes and is coating the epiphragma outside, the below that covers the position that epimembranal and golden finger correspond down isequipped with and covers the membrane and window, the reverse side of PI substrate exposes in the middle of the cover membrane is windowed, be equipped with the ground connection window on coating theepiphragma, the quantity o