Liquid crystal display module with heat abstractor

The utility model discloses a liquid crystal display module with heat abstractor, including display module assembly device main part, and a housing, the touch -control board, optical cement and polaroid, the top of display module assembly device main part is provided with miniature inflatable piece,...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
1. Verfasser:	ZHANG ENHAI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING FREQUENCY-CHANGING NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS PHYSICS TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The utility model discloses a liquid crystal display module with heat abstractor, including display module assembly device main part, and a housing, the touch -control board, optical cement and polaroid, the top of display module assembly device main part is provided with miniature inflatable piece, miniature inflatable piece and display module assembly device main part fixed connection, the quality that miniature inflatable piece has improved the product has prolonged the life of product, the bottom of optical cement is provided with glass substrate, glass substrate and optical cement fixed connection, glass substrate has improved the suitability of display module assembly device main part, the middle top of display module assembly device main part is provided with heat abstractor, heat abstractor and display module assembly device main part fixed connection, the security of display module assembly device main part has improved, the centre of display module assembly device main part is provided with the temp