System in package module

The utility model provides a system in package module, one of them is planted system in package module and can include: a substrate. Be located a plurality of electronic parts on the surface of substrate, the vertical interconnect structure, be located a plurality of electronic parts with the overla...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LAN H.HOANG, KATAHIRA TAKAYOSHI, LIU CHANG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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