System in package module

The utility model provides a system in package module, one of them is planted system in package module and can include: a substrate. Be located a plurality of electronic parts on the surface of substrate, the vertical interconnect structure, be located a plurality of electronic parts with the overlapping injection molding of vertical interconnect structure top, state the top shielding part that overlaps the injection molding top with being located, wherein the vertical interconnect structure is followed the substrate the surface extends to the bottom in the shallow trench groove in the top surface of overlapping injection molding, the vertical interconnect structure is in bottom department is electrically connected to the top shielding part. 本实用新型提供了系统级封装模块，其中种系统级封装模块可包括：衬底；位于所述衬底的表面上的多个电子部件；垂直互连结构；位于所述多个电子部件和所述垂直互连结构上方的重叠注塑件；和位于述重叠注塑件上方的顶部屏蔽件，其中所述垂直互连结构从所述衬底的所述表面延伸到所述重叠注塑件的顶表面中的浅沟槽的底部，所述垂直互连结构在所述底部处电连接到所述顶部屏蔽件。