Photoelectric encapsulation body

The utility model discloses a photoelectric encapsulation body, including line base plate, light electric chip, reflecting material, optical element and adhesive glue. Line base plate has supporting plane. Light electric chip install on supporting plane to the electrical connection line base plate. Light electric chip has the upper surface, is located the functional areas of upper surface and theside of connection upper surface. Reflecting material disposes in supporting plane to around light electric chip. Reflecting material covers the side to the inclined plane has. The inclined plane centers on the upper surface to edge extension from the upper surface. Reflecting material highly keeps away from light electric chip's direction and steadilys decrease from light electric chip orientation in the inclined plane. The adhesive glue covers reflecting material and light electric chip's upper surface to connect between light electric chip and optical element. 本实用新型公开种光电封装体，包括线路基板、光电芯片、反光材料、光学元件以及粘合胶。线路基板具有承载平面。光电芯