High temperature resistant emitting diode of high light efficiency
The utility model relates to a LED packaging technique field, and disclose a high temperature resistant emitting diode of high light efficiency, including encapsulation colloid, encapsulation colloid's bottom fixedly connected with base plate, the fixed surface of base plate is connected with t...
Gespeichert in:
1. Verfasser: | |
---|---|
Format: | Patent |
Sprache: | chi ; eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | The utility model relates to a LED packaging technique field, and disclose a high temperature resistant emitting diode of high light efficiency, including encapsulation colloid, encapsulation colloid's bottom fixedly connected with base plate, the fixed surface of base plate is connected with the electrode, the top fixedly connected with luminescent wafer of base plate, luminescent wafer's top fixedly connected with wafer electrode, the fixed surface of wafer electrode is connected with the bonding wire, encapsulation colloid's inside fixedly connected with bottom plate, the top fixedly connected with fixture block of bottom plate, connecting rod under the inside fixedly connected with of fixture block. This high temperature resistant emitting diode of high light efficiency through settingup the gyro wheel, can effectively protect the integrality of bonding wire to go, and can effectively solve the bonding wire through last gyro wheel and receive high temperature thermal expansion phenomenon, fixed, fixed eff |
---|