Pressure sensor packaging structure

The utility model discloses a pressure sensor packaging structure, including package substrate, package substrate's edge is equipped with round rigidity colloid, the inside cavity that forms of rigidity colloid, be equipped with the chip in the cavity, the pad of chip passes through gold thread and package substrate's solder connection, and the gold thread becomes the arc, the upper surface that reaches the rigidity colloid in the cavity is all filled by flexible colloid, the top surface of flexible colloid be H to package substrate's distance, and the top surface of rigidity colloid is h to package substrate's distance, and the distance that package substrate was arrived on the summit of gold thread arc is h1, just satisfies H > h > h1. It is sticky to the package substrate that the chippasses through the bonding die. The utility model discloses under the circumstances of guaranteeing pressure sensor excellent performance, guaranteed not only that the appearance rule of product justhas rigidity to reach the