Three -dimensional multicavity micropunch cycle superwide band sound absorbing structure

The utility model relates to a three -dimensional multicavity micropunch cycle superwide band sound absorbing structure. Parallel arrangement cross section, period structure's the vertical terminal surface of parallel arrangement, unit bottom plate by micropunch panel, period structure link to...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: ZHU XINGYI, WANG XU, YU JIANGLING, MAO DONGXING, JIANG ZAIXIU, ZHANG HENG, YU WUZHOU
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:The utility model relates to a three -dimensional multicavity micropunch cycle superwide band sound absorbing structure. Parallel arrangement cross section, period structure's the vertical terminal surface of parallel arrangement, unit bottom plate by micropunch panel, period structure link to each other and form the sealed cavity that the cycle was arranged on two orthogonal directions, and in large quantities in 2, preferred 3 or 4, the depth capacity is 1.5~5 times of the minimum degree of depth. 0.2%~5% the micropore that distributes on the micropunch panel and have shared area to amass for panel faces, the micropore aperture is 0.2~1.2mm, and unit width and length are all no longer than 0.15m. It will to need only during the use the utility model discloses install the place that needssound absorption treatment, it can on the wall to fix. The utility model discloses the device is simple, and processing is simple and convenient, and the thin type is light, and acoustic absorption performance is good, and t