Hot switch chip on way is taken back to on surface

The utility model provides a heat exchanger technical field's hot switch chip on way is taken back to on surface, includes through stamping forming's plane sheet metal and sets up at plane sheet metalturn -ups all around, the plane sheet metal on be equipped with confined hollow structure, hollow structure is protruding on one side of the sheet metal of plane, the opposite side is sunken, the protruding side of hollow structure is provided with a plurality of sunken cell type return circuits on the sheet metal of plane. The utility model discloses in hot switch chip surface shaping cell typereturn circuit, increase hot switch chip heat radiating area, when improving its hot exchange capacity, realized hot switch chip's lightweight. 种换热器技术领域的表面带回路的热交换芯片，包括通过冲压成型的平面薄板及设置在平面薄板四周的翻边，所述的平面薄板上设有封闭的中空结构，所述中空结构在平面薄板侧凸起、另侧凹陷；于平面薄板上中空结构凸起侧设置有若干凹陷的槽型回路。本实用新型在热交换芯片表面成型槽型回路，增加热交换芯片散热面积，提高其热交换能力的同时，实现了热交换芯片的轻量化。