Semiconductor device

The utility model discloses a semiconductor device is for a packaging structure who improves the heat dissipation and fall low -resistance. Semiconductor device contains base plate, wafer, first clamping piece and second clamping piece. The wafer contains the first transistor and the second transistor of common drain, and the drain links this base plate altogether. The source electrode of a clamping piece connecting the first transistor, the electrical property separation each other of the source electrode of the 2nd clamping piece connecting second transistor, first clamping piece and secondclamping piece. 本实用新型关于种半导体装置，为种改善散热及降低阻值的封装结构。半导体装置包含基板、晶片、第夹片及第二夹片。晶片包含共汲极的第晶体管及第二晶体管，且共汲极连该基板。第夹片连接第晶体管的源极；第二夹片连接第二晶体管的源极，第夹片及第二夹片彼此电性分离。