Face down chip formula wave filter packaging structure
The utility model relates to a wave filter specifically is the packaging structure who says a face down chip formula wave filter. A face down chip formula wave filter packaging structure, includes base plate, protection cladding material, chip and connection foot, wherein, protection cladding materi...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The utility model relates to a wave filter specifically is the packaging structure who says a face down chip formula wave filter. A face down chip formula wave filter packaging structure, includes base plate, protection cladding material, chip and connection foot, wherein, protection cladding material main part be adj. Tabular, its center part have with chip size assorted recess, the peripheral formation connecting portion of recess, the chip is through connecting foot in base plate key -type connection, protection cladding material passes through connecting portion and fixes on the base plate, and with chip package in the recess. Among this packaging structure, because at cavity protection cladding material on the outside cover of chip, prevented that the encapsulating compound adhesion from to chip surface's the transducer, having improved the performance of product effectively. Because cavity protection cladding material adopts the metal material, has had blocking function simultaneously.
本实用新型的涉及种滤波器,具体是讲 |
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