Be applied to vacuum adsorption fast -mounting type vibration of chip class device and use device

The utility model relates to a be applied to vacuum adsorption fast -mounting type vibration of chip class device and use device measures technical field frequently when relating to. The utility modelprovides a be applied to vacuum adsorption fast -mounting type vibration of chip class device and use device is formed by top cap and box body vacuum brazing, forms a hollow airtight cavity in inside. An air cock has been reserved to the cavity, can with the help of the vacuum pump as to this airtight cavity realize taking out vacuum treatment to realize the quick absorption of chip product and minature device. 本实用新型涉及种应用于芯片类器件的真空吸附快装型振动用装置，涉及时频测量技术领域。本实用新型提出了种应用于芯片类器件的真空吸附快装型振动用装置，由顶盖和盒体真空钎焊而成，形成个内部中空的密闭腔体。腔体预留了个气嘴，可以借助真空泵对此密闭腔体实现抽真空处理，从而实现芯片产品和小型器件的快速吸附。