Thermal -insulated keysets and semiconductor device

The utility model discloses a thermal -insulated keysets and semiconductor device is equipped with on the keysets that insulates against heat and passes the piece mouth, is equipped with annular groove at one side surface loop of thermal -insulated keysets around passing the piece mouth, and annular...

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Bibliographische Detailangaben
1. Verfasser: DUAN CHENYUE
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:The utility model discloses a thermal -insulated keysets and semiconductor device is equipped with on the keysets that insulates against heat and passes the piece mouth, is equipped with annular groove at one side surface loop of thermal -insulated keysets around passing the piece mouth, and annular groove is used for holding the sealing washer, and the periphery of following annular groove is equipped with at least one heat dam, is equipped with heat insulation part in the heat dam, and heat insulation part protrusion an in side surface of thermal -insulated keysets. Should can avoid the direct contact by a large scale with process chamber by thermal -insulated keysets to effective completely cutting off comes from the heat of process chamber cavity, and can not show the bulk strength ofthe thermal -insulated keysets of influence. 本实用新型公开了种隔热转接板和半导体设备,隔热转接板上设有传片口,在隔热转接板的侧表面环绕传片口设有环型槽,环型槽用于容纳密封圈,沿环型槽的外周设有至少个隔热槽,隔热槽内设有隔热件,且隔热件凸出于隔热转接板的侧表面。该隔热转接板可以避免与工艺腔大面积的直接接触,从而有效隔绝来自于工艺腔腔室的热量,并且不会显著影响隔热转接板的整体强度。