Semiconductor manufacturing mould

The utility model discloses a semiconductor manufacturing mould, its structure includes clamp plate, roof, locating plate, fixed suction cup, the clamp plate is equipped with telescopic link, bearingboard, the roof is equipped with connecting rod, non -slip rubber circle, gasket, the locating plate...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	WU HANGRUI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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