Semiconductor manufacturing mould

The utility model discloses a semiconductor manufacturing mould, its structure includes clamp plate, roof, locating plate, fixed suction cup, the clamp plate is equipped with telescopic link, bearingboard, the roof is equipped with connecting rod, non -slip rubber circle, gasket, the locating plate is equipped with the U template, fixed suction cup is equipped with packing ring, connector, screwed connection pole, gland nut, blowout patche, rubber suction cups, the utility model discloses a be equipped with a fixed suction cup, can fix the mould on desktop or workstation, can avoid the mouldin the course of the work because vibrations or artificially touch and shift cause the project progress to delay, influence product quality. 本实用新型公开了种半导体制造模具，其结构包括压板、顶板、定位板、固定吸盘，所述压板设有伸缩杆、承托板，所述顶板设有连接杆、防滑橡胶圈、垫片，所述定位板设有U型板，所述固定吸盘设有垫圈、连接头、螺旋连接杆、压紧螺母、轴圈、橡胶吸盘，本实用新型通过设有种固定吸盘，能够将模具固定在桌面或工作台上，能够避免模具在工作过程中因为震动或人为触碰而移位，造成工程进度延误，影响产品质量。