Preparation equipment of substrate material

The utility model provides a preparation equipment of substrate material, it shakes to adopt the ultrasonic wave will grind throwing liquid at substrate attenuate in -process, make the whole in -process thick liquids can the homodisperse, it throws the stability and the wafer no scratch in surface t...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LAI BAIFAN, CHEN WENPENG, LIN WUQING
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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