Preparation equipment of substrate material

The utility model provides a preparation equipment of substrate material, it shakes to adopt the ultrasonic wave will grind throwing liquid at substrate attenuate in -process, make the whole in -process thick liquids can the homodisperse, it throws the stability and the wafer no scratch in surface t...

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Bibliographische Detailangaben
Hauptverfasser: LAI BAIFAN, CHEN WENPENG, LIN WUQING
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The utility model provides a preparation equipment of substrate material, it shakes to adopt the ultrasonic wave will grind throwing liquid at substrate attenuate in -process, make the whole in -process thick liquids can the homodisperse, it throws the stability and the wafer no scratch in surface that removes speed to reach to grind, make the substrate shape of face satisfy the required precision, the ultrasonic wave is through adjusting current frequency, make the ripples that vibrate the son and can send certain frequency, can make through hyperacoustic shock and reunite originally or the dispersion of sedimentary abrasive material, see through the impurity and bubble filtration of folding filter core with vibrating process, increase the homogeneity mesh that the wafer surface removed in order to reach dispersed abrasive material, the volume of removing that makes the substrate reaches corresponding index requirement with surface quality. 本实用新型提供了种衬底材料的制作设备,采用超声波在衬底减薄过程中将磨抛液进行震动,使整个过程中浆料可以均匀分散,达到磨抛移除速率的稳定与