Slim fingerprint chip packaging structure

The utility model provides a slim fingerprint chip packaging structure, be in including fingerprint identification chip, setting around the fingerprint identification chip lead electrical pillar and through leading the flexible circuit board that electrical pillar links to each other with the fingerprint identification chip, the connection pad that the fingerprint identification chip includes thefingerprint identification district and is located the fingerprint identification foreign, the one side of leading electrical pillar, should be led electrical pillar's opposite side and be connected with the flexible circuit board with to be connected the pad continuous through the layer of rerouting. 本实用新型提供种薄型指纹芯片封装结构，包括指纹识别芯片、设置在所述指纹识别芯片周围的导电柱和通过导电柱与指纹识别芯片相连的柔性电路板，所述指纹识别芯片包括指纹识别区和位于指纹识别区外的连接焊盘，所述导电柱的侧通过重布线层与连接焊盘相连，该导电柱的另侧与柔性电路板连接。