Add accepted way of doing sth circuit board entirely and manufacture equipment thereof

The utility model discloses an add accepted way of doing sth circuit board entirely and manufacture equipment thereof, manufacture equipment include a printing device and one set up the chemical plating device after printing device, wherein printing device can have catalytic activity according to th...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: LIANG LONGZHEN, LAI HONGSHENG
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The utility model discloses an add accepted way of doing sth circuit board entirely and manufacture equipment thereof, manufacture equipment include a printing device and one set up the chemical plating device after printing device, wherein printing device can have catalytic activity according to the patterning of setting for a boundary layer on a flexible base plate, the chemical plating device can restore deposition of metal on the boundary layer to form a patterning metallic wiring layer. Through the aforesaid design, can be with heavy and complicated manufacturing process of the retrenching. 本实用新型公开种全加成式线路板及其制造设备,制造设备包括印刷装置及设置于印刷装置之后的化镀装置,其中印刷装置能根据设定的图案形成具有催化活性的界面层于柔性基板上,化镀装置能于界面层上还原沉积金属,以形成图案化金属线路层。通过上述设计,能将繁复的制造工序精简化。