Electrode equipment for copper plating bath
The utility model relates to an electrode equipment for copper plating bath, including positive pole, the negative pole of connection on the copper bar, auxiliary anode, this auxiliary anode has the titanium of iridium, ruthenium or tantalum metal level blue for the surface coating, positive target...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The utility model relates to an electrode equipment for copper plating bath, including positive pole, the negative pole of connection on the copper bar, auxiliary anode, this auxiliary anode has the titanium of iridium, ruthenium or tantalum metal level blue for the surface coating, positive target in auxiliary anode position and copper bar lug connection. Compared with the prior art, the utilitymodel discloses a lift of auxiliary anode position is guaranteed the oxygen that the positive pole produced and can be discharged rapidly, and reduce the influence to additive in the copper liquid, through using auxiliary anode, the copper ball utilization ratio is brought up to more than 90%, and economic benefits is obvious.
本实用新型涉及种电镀铜槽用电极设备,包括连接在铜排上的阳极、阴极,辅助阳极,该辅助阳极为表面涂覆有铱、钌或钽金属层的钛蓝,辅助阳极位置正对阴极,和铜排直接连接。与现有技术相比,本实用新型通过辅助阳极位置的升降,保证阳极产生的氧气能迅速排出,减少对铜液中添加剂的影响,通过使用辅助阳极,铜球利用率提高到90%以上,经济效益明显。 |
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