IC chip testing arrangement's shock -absorbing structure

The utility model discloses a IC chip testing arrangement's shock -absorbing structure, including circuit board, solid fixed ring, first picture layer, compression spring and object placement board, the upper surface left side of circuit board is provided with the louvre, the right side of louv...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: YANG GENGHUA
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The utility model discloses a IC chip testing arrangement's shock -absorbing structure, including circuit board, solid fixed ring, first picture layer, compression spring and object placement board, the upper surface left side of circuit board is provided with the louvre, the right side of louvre is provided with the relay, the right side below of relay is provided with electric capacity, the right side below of electric capacity is provided with the fretwork groove, the right side top of electric capacity is provided with the ceramic disc capacitor, the left side top of ceramic disc capacitoris provided with the small opening, four corners at object placement board are provided with four support columns, and the inside compression spring that is provided with of support column, user examine time measuring, and through the contact detection IC chip of universal meter, when the contact exerted pressure for the IC chip, the compression spring atress was flexible, first picture layer andsecond picture layer coop