Substrate processing apparatus

The utility model relates to a substrate processing apparatus, in particular to coating film's substrate processing apparatus. Can effectively improve coating film's the homogeneity that the membraneis thick. Coating and developing apparatus possess: the nozzle, it spouts source reason liq...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KENTARO YOSHIHARA, KOUZO NISHI, MASANOBU WATANABE, SEIYA TOTSUKA, SHINICHI HATAKEYAMA
Format: Patent
Sprache:chi ; eng
Schlagworte:
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Beschreibung
Zusammenfassung:The utility model relates to a substrate processing apparatus, in particular to coating film's substrate processing apparatus. Can effectively improve coating film's the homogeneity that the membraneis thick. Coating and developing apparatus possess: the nozzle, it spouts source reason liquid to the wafer, forced lubrication portion, it carries the treatment fluid to the pressurization of nozzleside, the liquid supply tube way, it has valve (53, 54) that the forced lubrication portion of following side direction nozzle side was arranged for the portion guides the treatment fluid to the nozzle from the forced lubrication, the device also comprises a controlle. The controller constitutes for action below carrying out: valve (54) close and valve (53) and valve (54) between pressure ratio forced lubrication portion and the state that pressure is high between valve (53) under open valve (53), control forced lubrication portion so that because open valve (53) valve (53) and the overpressure between valve (54) that