High -efficient heat dissipation metal substrate

The utility model discloses a high -efficient heat dissipation metal substrate, including the circuit board to and the insulating layer of pressfitting on one side of the circuit board, insulating layer one side of circuit board dorsad is provided with the recess, and the pressfitting has the metal sheet in the recess, is provided with the spliced eye on circuit board and the insulating layer respectively. The problem of can only be for surface mounting process welds in the traditional handicraft, there have installation intensity to be not enough is solved, the utility model discloses simplestructure can satisfy multilayer circuit board's grafting requirement again when reaching the radiating effect. 本实用新型公开了种高效散热金属基板，包括线路板，以及压合在线路板侧的绝缘层，绝缘层背向线路板的侧设置有凹槽，凹槽内压合有金属板，线路板与绝缘层上分别设置有插接孔。解决了传统工艺中只能为表面贴装工艺焊接，存在安装强度不足的问题，本实用新型结构简单，达到散热效果的同时又能满足多层线路板的插接要求。