Double -face flexible circuit board
The application discloses a double -face flexible circuit board, including an insulation base layer, an insulation base layer's upper surface is equipped with top conducting wire layer and top insulation film layer in proper order, conducting wire layer and bottom insulation film layer bottom i...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The application discloses a double -face flexible circuit board, including an insulation base layer, an insulation base layer's upper surface is equipped with top conducting wire layer and top insulation film layer in proper order, conducting wire layer and bottom insulation film layer bottom its lower surface is equipped with in proper order, be equipped with manyly to first through -hole on theinsulation film layer of top, whenever include positive pole through hole and negative pole through -hole to first through -hole for the component is realized establishing ties on can welding it, topinsulation film layer's both ends are equipped with a pair of tip through -hole respectively, whenever include positive pole through hole and negative pole through -hole to the tip through -hole, positive pole through hole in top conducting wire layer and an insulation base layer and the tip through -hole, the position that the negative pole through -hole corresponds form the through hole, the area of through hole is light |
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