Electron device encapsulates shell

The utility model relates to an integrated circuit package technical field especially relates to an electron device encapsulates shell, including LTCC substrate, metal frame and apron, the LTCC substrate includes top layer, intermediate level and bottom, and the top layer includes framework solderin...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	WANG XIALIAN, WU LEI, YU CHANGCUN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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