Electron device encapsulates shell

The utility model relates to an integrated circuit package technical field especially relates to an electron device encapsulates shell, including LTCC substrate, metal frame and apron, the LTCC substrate includes top layer, intermediate level and bottom, and the top layer includes framework soldering zone and components and parts district, and the bottom forms the plane grid array on the positionthat corresponds the components and parts district, and the components and parts district passes through the intermediate level with the plane grid array and is connected, and framework soldering zoneencirclement components and parts are distinguished, the lower skin weld of framework soldering zone and metal frame, the upper surface and the cover connection of metal frame. From this the utilitymodel discloses a LTCC substrate becomes the partly of whole encapsulation shell as the carrier, has both undertaken the mode of drawing forth of drawing forth the foot, has undertaken equipments suchas the function wiring of c