Heat radiation structure of high -power UV LED metal substrate and PCB contact
The utility model discloses a heat radiation structure of high -power UV LED metal substrate and PCB contact, include PCB board, heat radiation structure layer, fixed recess, heat dissipation arch, metal substrate, heat -conducting plate, bump, lead heat -insulating material and chamfer structure, t...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The utility model discloses a heat radiation structure of high -power UV LED metal substrate and PCB contact, include PCB board, heat radiation structure layer, fixed recess, heat dissipation arch, metal substrate, heat -conducting plate, bump, lead heat -insulating material and chamfer structure, the PCB board is installed to heat radiation structure layer top, and to be fixed with the heat dissipation protruding in the below, set up on the metal substrate and fix the recess with the protruding assorted of heat dissipation, the heat radiation structure layer comprises heat -conducting plate and heat dissipation arch jointly, and the protruding middle part of heat dissipation sets up to leading heat -insulating material, it is provided with the bump all around to lead heat -insulating material, the bump front end is provided with the chamfer structure. The heat radiation structure of this high -power UVLED metal substrate and PCB contact adopts embedded heat radiation structure to setup, and the structure is |
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