Circuit board
The utility model discloses a circuit board contains the substrate, is formed with the line layer on the substrate, and circuit board still contains the printing layer, and the printing layer coats onthe line layer, through set up the printing layer on the surface at circuit board for circuit board...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The utility model discloses a circuit board contains the substrate, is formed with the line layer on the substrate, and circuit board still contains the printing layer, and the printing layer coats onthe line layer, through set up the printing layer on the surface at circuit board for circuit board has high pressure resistant, resistant insulating, high temperature resistance characteristic, hasreduced manufacturing cost simultaneously, printing layer and circuit board surface compaginate seamlessly together, also reducible circuit board's quality hidden danger problem.
本实用新型公开了种线路板,包含基材,基材上形成有线路层,线路板还包含印刷层,印刷层涂覆于线路层上,通过在线路板表面上设置印刷层,使得线路板具有耐高压、耐绝缘、耐高温的特性,同时降低了生产成本;印刷层与线路板表面牢固结合在起无缝隙,亦可减少线路板的品质隐患问题。 |
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