Two tripolar tube packaging structures of low energy consumption flip -chip
The utility model discloses a two tripolar tube packaging structures of low energy consumption flip -chip adopts chip flip -chip structure, contains ceramic substrate, its characterized in that: easyinstallation, the long limit of ceramic substrate orientation, yi bian there is a first conductive la...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The utility model discloses a two tripolar tube packaging structures of low energy consumption flip -chip adopts chip flip -chip structure, contains ceramic substrate, its characterized in that: easyinstallation, the long limit of ceramic substrate orientation, yi bian there is a first conductive layer, the another side has two first conductive layers, be provided with flip -chip no. 2, triode chip in three first conductive layers tops, three first conductive layers are connected with the chip electrode of flip -chip no. 2, triode chip below respectively, the performance is improved. The utility model discloses packaging structure adopts face down chip, improves the reliability of product processing procedure and the production efficiency of manufacturing by a wide margin, and the productis also more frivolous, is fit for miniaturized design demand, the ceramic substrate who adopts is showing the thermal conductivity who has promoted the product, makes product performance when usingmore stable, packaging stru |
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