High density multilayer circuit board

The utility model discloses a high density multilayer circuit board, including circuit board, electronic component and socket, circuit board fixed surface has electronic component, and electronic component one end is connected with wiring area, electronic component one side is fixed with the socket,...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HE FATING, MA ZHUO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CURRENT COLLECTORS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LINE CONNECTORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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