High density multilayer circuit board
The utility model discloses a high density multilayer circuit board, including circuit board, electronic component and socket, circuit board fixed surface has electronic component, and electronic component one end is connected with wiring area, electronic component one side is fixed with the socket,...
Gespeichert in:
Hauptverfasser: | , |
---|---|
Format: | Patent |
Sprache: | chi ; eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | The utility model discloses a high density multilayer circuit board, including circuit board, electronic component and socket, circuit board fixed surface has electronic component, and electronic component one end is connected with wiring area, electronic component one side is fixed with the socket, the circuit board comprises pad, insulation board and bottom plate, the pad surface is run throughthere is the pin preformed hole, the insulation board surface is equipped with the via hole, via hole one side is equipped with the fixed orifices, floor surfaces is equipped with and meets electricalpillar, connect electrical pillar one side to be equipped with the fixed column, pad surface edge is provided with electric border, electric border surface is equipped with the mounting hole. The utility model relates to an it is equitable novel, be convenient for production and installation, the circuit board receives the ying county of temperature, dust less realizing that its life of multi -storied while of high densit |
---|