High density multilayer circuit board

High density multilayer circuit board

The utility model discloses a high density multilayer circuit board, including circuit board, electronic component and socket, circuit board fixed surface has electronic component, and electronic component one end is connected with wiring area, electronic component one side is fixed with the socket,...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: HE FATING, MA ZHUO
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CURRENT COLLECTORS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LINE CONNECTORS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator HE FATING
MA ZHUO
description The utility model discloses a high density multilayer circuit board, including circuit board, electronic component and socket, circuit board fixed surface has electronic component, and electronic component one end is connected with wiring area, electronic component one side is fixed with the socket, the circuit board comprises pad, insulation board and bottom plate, the pad surface is run throughthere is the pin preformed hole, the insulation board surface is equipped with the via hole, via hole one side is equipped with the fixed orifices, floor surfaces is equipped with and meets electricalpillar, connect electrical pillar one side to be equipped with the fixed column, pad surface edge is provided with electric border, electric border surface is equipped with the mounting hole. The utility model relates to an it is equitable novel, be convenient for production and installation, the circuit board receives the ying county of temperature, dust less realizing that its life of multi -storied while of high densit
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN206879214UU</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN206879214UU</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN206879214UU3</originalsourceid><addsrcrecordid>eNrjZFD1yEzPUEhJzSvOLKlUyC3NKcnMSaxMLVJIzixKLs0sUUjKTyxK4WFgTUvMKU7lhdLcDEpuriHOHrqpBfnxqcUFicmpeakl8c5-RgZmFuaWRoYmoaHGRCkCAKTpKDE</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>High density multilayer circuit board</title><source>esp@cenet</source><creator>HE FATING ; MA ZHUO</creator><creatorcontrib>HE FATING ; MA ZHUO</creatorcontrib><description>The utility model discloses a high density multilayer circuit board, including circuit board, electronic component and socket, circuit board fixed surface has electronic component, and electronic component one end is connected with wiring area, electronic component one side is fixed with the socket, the circuit board comprises pad, insulation board and bottom plate, the pad surface is run throughthere is the pin preformed hole, the insulation board surface is equipped with the via hole, via hole one side is equipped with the fixed orifices, floor surfaces is equipped with and meets electricalpillar, connect electrical pillar one side to be equipped with the fixed column, pad surface edge is provided with electric border, electric border surface is equipped with the mounting hole. The utility model relates to an it is equitable novel, be convenient for production and installation, the circuit board receives the ying county of temperature, dust less realizing that its life of multi -storied while of high densit</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CURRENT COLLECTORS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; LINE CONNECTORS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20180112&amp;DB=EPODOC&amp;CC=CN&amp;NR=206879214U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20180112&amp;DB=EPODOC&amp;CC=CN&amp;NR=206879214U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HE FATING</creatorcontrib><creatorcontrib>MA ZHUO</creatorcontrib><title>High density multilayer circuit board</title><description>The utility model discloses a high density multilayer circuit board, including circuit board, electronic component and socket, circuit board fixed surface has electronic component, and electronic component one end is connected with wiring area, electronic component one side is fixed with the socket, the circuit board comprises pad, insulation board and bottom plate, the pad surface is run throughthere is the pin preformed hole, the insulation board surface is equipped with the via hole, via hole one side is equipped with the fixed orifices, floor surfaces is equipped with and meets electricalpillar, connect electrical pillar one side to be equipped with the fixed column, pad surface edge is provided with electric border, electric border surface is equipped with the mounting hole. The utility model relates to an it is equitable novel, be convenient for production and installation, the circuit board receives the ying county of temperature, dust less realizing that its life of multi -storied while of high densit</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CURRENT COLLECTORS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>LINE CONNECTORS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFD1yEzPUEhJzSvOLKlUyC3NKcnMSaxMLVJIzixKLs0sUUjKTyxK4WFgTUvMKU7lhdLcDEpuriHOHrqpBfnxqcUFicmpeakl8c5-RgZmFuaWRoYmoaHGRCkCAKTpKDE</recordid><startdate>20180112</startdate><enddate>20180112</enddate><creator>HE FATING</creator><creator>MA ZHUO</creator><scope>EVB</scope></search><sort><creationdate>20180112</creationdate><title>High density multilayer circuit board</title><author>HE FATING ; MA ZHUO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN206879214UU3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2018</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CURRENT COLLECTORS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>LINE CONNECTORS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>HE FATING</creatorcontrib><creatorcontrib>MA ZHUO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HE FATING</au><au>MA ZHUO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>High density multilayer circuit board</title><date>2018-01-12</date><risdate>2018</risdate><abstract>The utility model discloses a high density multilayer circuit board, including circuit board, electronic component and socket, circuit board fixed surface has electronic component, and electronic component one end is connected with wiring area, electronic component one side is fixed with the socket, the circuit board comprises pad, insulation board and bottom plate, the pad surface is run throughthere is the pin preformed hole, the insulation board surface is equipped with the via hole, via hole one side is equipped with the fixed orifices, floor surfaces is equipped with and meets electricalpillar, connect electrical pillar one side to be equipped with the fixed column, pad surface edge is provided with electric border, electric border surface is equipped with the mounting hole. The utility model relates to an it is equitable novel, be convenient for production and installation, the circuit board receives the ying county of temperature, dust less realizing that its life of multi -storied while of high densit</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language chi ; eng
recordid cdi_epo_espacenet_CN206879214UU
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CURRENT COLLECTORS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LINE CONNECTORS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title High density multilayer circuit board
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-29T15%3A25%3A55IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=HE%20FATING&rft.date=2018-01-12&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN206879214UU%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true