Package substrate and use this package substrate's semiconductor packaging pieces

The utility model discloses a package substrate and use this package substrate's semiconductor packaging pieces. The utility model discloses a package substrate that an embodiment provided contains: first dielectric layer, the first conducting layer that lies in the relative both sides of this first dielectric layer and second conducting layer reach at least one and switch on the post. This at least one switch on the post through the configuration with required electrical connection between the different conducting layers that provide this package substrate. This package substrate further contains: the first line structure, the second line structure, an at least resistance element and an at least capacity cell, wherein this the first line structure lies in this first conducting layer with this at least resistance element, and this the second line structure lies in this second conducting layer with this at least capacity cell's second electrode piece. The utility model discloses can be with the whole miniaturi