Circuit board is electroplated with impurity metal -adsorbing device

The utility model provides a circuit board is electroplated with impurity metal -adsorbing device, includes: impurity metal -adsorbing copper and suspension group. A plurality of adsorption tanks have been seted up on the impurity metal -adsorbing copper. Suspension group is including hanging diaphr...

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Bibliographische Detailangaben

Hauptverfasser:	ZHUO ZHUYANG, SUN HONGYUN, LI WEIYUAN, XU YINGJUN, TAN WEIJIAO, CHEN ZEYIN, WANG CHAOYUN, SUN BENZHONG, ZHANG ZIDIAN, LIANG HESHENG, WANG CHENGYUAN, QU HONGMIN, DU XIONG, ZHANG JIMEI, ZHOU YANXIANG, XIN HUANLU, LIANG QINGYU, WU ZESHUI, XIAO GUIRONG, XIE LEI, HUANG FUCHENG, LIU CHUNMING, ZOU HAIBO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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