Circuit board is electroplated with impurity metal -adsorbing device
The utility model provides a circuit board is electroplated with impurity metal -adsorbing device, includes: impurity metal -adsorbing copper and suspension group. A plurality of adsorption tanks have been seted up on the impurity metal -adsorbing copper. Suspension group is including hanging diaphr...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The utility model provides a circuit board is electroplated with impurity metal -adsorbing device, includes: impurity metal -adsorbing copper and suspension group. A plurality of adsorption tanks have been seted up on the impurity metal -adsorbing copper. Suspension group is including hanging diaphragm, first installation riser, second installation riser, first fastener and second fastener. Hanging the diaphragm and having seted up double -layered groove, the bottom that presss from both sides the groove is provided with a plurality of sand grips. The material of impurity metal -adsorbing copper is copper, scraps when retrieving impurity metal -adsorbing copper, can retrieve impurity metal -adsorbing copper together together with the copper layer of containing the foreign metal that its surface formed, and is higher to the copper layer recovery efficiency who contains the foreign metal. When needs with the anchor clamps centre gripping when hanging the diaphragm, only need stretch into the clamping piece of a |
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