Make emitting diode mould
The utility model discloses a make emitting diode mould, including upper die base and die holder, a plurality of assorted sealing cap die cavity has been put to a surface distribution that upper die base and die holder correspond, and the front end of every sealing cap die cavity is equipped with th...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The utility model discloses a make emitting diode mould, including upper die base and die holder, a plurality of assorted sealing cap die cavity has been put to a surface distribution that upper die base and die holder correspond, and the front end of every sealing cap die cavity is equipped with the clamping groove that is used for fixed emitting diode pin, run through on the upper die base and be equipped with the through -hole of moulding plastics, the underrun screw fixation of die holder has lower heat insulating board, and the top surface of upper die base has last heat insulating board through the screw fixation, and the central authorities that are located the heat insulating board are equipped with a mount pad, carries out the cylinder on the mount pad about vertical being equipped with. The utility model discloses a mould convenient operation, upper die base and die holder correspondence are equipped with sealing cap die cavity and clamping groove, will connect the pin of sending out optical chip an |
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