FRCC substrate with high heat dissipation efficiency

The utility model discloses a FRCC substrate with high heat dissipation efficiency, from the bottom up include copper foil layer, first semi -solid preparation adhesion coating, insulating polymer layer and second semi -solid preparation adhesion coating in proper order, in addition from the type layer, and one of at least for the homodisperse has a first heat dissipation insulating polymer layer of dispelling the heat the powder in the top layer on insulating polymer layer and the bottom, one of at least for the homodisperse has dispel the heat a heat conduction adhesion coating of powder of second in first semi -solid preparation adhesion coating and the second semi -solid preparation adhesion coating, the utility model discloses not only have good anti voltage breakdown nature, excellent thermal diffusivity and higher transparency, moreover can of the approaching overall product thickness, improve the competitiveness of this product, in addition, the utility model discloses a manufacturing process is simpl