Slim array plastic package spare

The utility model provides a slim array plastic package spare, includes carrier, lead bonding pad, ground loop, IC chip, bonding wire, packaging part and solder ball, DAP is distinguished to the intermediate position of carrier for the chip bonds, chip bonding district DAP sets up the IC chip, the edge of carrier is provided with the ground loop, and the ground loop comprises the multilayer metal of stack on the carrier, the lead bonding pad is multirow array mode and arranges around the carrier, the lead bonding pad comprises the multilayer metal, the IC chip passes through bonding wire electric connection in lead bonding pad and ground loop respectively, the packaging body is used for the partly of cladding IC chip, bonding wire and lead bonding pad and carrier, and wherein the outer hourglass in the bottom of carrier is outside the packaging body, the solder ball sets up in the bottom of packaging body to be connected with the lead bonding pad. The utility model discloses simple structure is compact, leaks