Mobile terminal shield assembly

The application discloses mobile terminal shield assembly, including the shield cover, the shield cover covers the electronic component who installs on printed circuit board and welds on printed circuit board, and the shield cover outside is covered with the structure shell spare of welding on printed circuit board, its characterized in that, the shield cover top corresponds the position with the highest electronic component and is equipped with the bellying, and structure shell spare corresponds the position with the shield cover bellying and is equipped with the recess. According to the technical scheme of this application embodiment, through the structure that changes shield cover and shell structure, reduced the highest electronic component thickness to the influence of mobile terminal thickness, can with mobile terminal do thinner. 本申请公开了种移动终端屏蔽装置，包括屏蔽罩，屏蔽罩罩住安装于印刷电路板上的电子元件并焊接在印刷电路板上，屏蔽罩外部罩有焊接在印刷电路板上的结构壳件，其特征在于，屏蔽罩顶部与最高的电子元件对应位置设有凸起部，结构壳件与屏蔽罩凸起部对应位置设有凹槽。根据本申请实施例的技术方案，通过改变屏蔽罩及其结构壳体的结构，降低了最高电子元件厚度对移动终端厚度的影响