Chip level white light LED packaging structure

The utility model discloses a chip level white light LED packaging structure, be equipped with the LED face down chip of electrode including the bottom surface, and the encapsulation colloid layer that reduces in proper order of a plurality of layer from interior to exterior refracting index of encapsulation on LED face down chip, be equipped with the reflector layer in the bottom on encapsulation colloid layer. The encapsulation colloid layer is equipped with the three -layer, bonds each other. The encapsulation colloid layer is transparent adhesive tape or fluorescent glue. Encapsulation colloid layer package is around covering LED face down chip's upper surface and side. Chip level LED packaging structure glues coating technology at chip upper surface and the encapsulation of side adoption multilayer, and the refracting index from interior to exterior that the encapsulation was glued is extremely low by the height in proper order, reduces the refringence between chip and the air, and the effectual total re