LED packaging structure of formal dress COB base plate

The utility model discloses a LED packaging structure of formal dress COB base plate, including mirror aluminum substrate, be equipped with both sides insulating layer and the solid crystalline region of mirror surface aluminium on mirror aluminum substrate's surface, be equipped with a plurality of chips that array distributes that are at the solid crystalline region of mirror surface aluminium, the periphery that respectively is the chip of array distribution is equipped with isolated electrode, connects through isolated electrode between the chip. Isolated electrode package draws together the middle part insulating layer, and it has the silver lustre plating layer to distribute on the insulating layer of middle part, and the chip is connected with the silver lustre plating layer through the lead wire. The utility model discloses a provide new thinking during the operation of formal dress COB product bonding wire, can avoid promoting the shipment rate of COB product because of the chip is bad, rosin joint,