Prevent flexible circuit board of sweat erosion

The utility model discloses a prevent flexible circuit board of sweat erosion, flexible circuit board includes that FPC substrate, FPC cover membrane, FPC surface gold layer and the solvent of resistant the sweat, the FPC substrate includes that multi -layered board and multi -layered board stack gr...

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1. Verfasser: LIN QIXING
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:The utility model discloses a prevent flexible circuit board of sweat erosion, flexible circuit board includes that FPC substrate, FPC cover membrane, FPC surface gold layer and the solvent of resistant the sweat, the FPC substrate includes that multi -layered board and multi -layered board stack gradually the setting, it covers the membrane to be equipped with FPC on the FPC substrate, FPC covers the membranous part branch and does not cover FPC, FPC surface gold layer sets up on the FPC substrate, be equipped with the solvent of nai the sweat on the gold layer of FPC surface. The utility model discloses an use hole sealing agent, increase golden nickel thickness and design optimization for flexible circuit board has the characteristic of preventing the sweat and corroding, thereby has lengthened the life -span that people's physical contact object of being made by the FPC of resistant artifical sweat used, still improves the wear -resisting of product, the perspiration resistance can, have the value of popu