It is heat sink to receive composite construction surface a little
The utility model discloses an it is heat sink to receive composite construction surface a little for high thermal current density's heat dissipation problem is solved in power electronic integrated device heat transfer field. The utility model discloses an it is heat sink to receive composite...
Gespeichert in:
Hauptverfasser: | , |
---|---|
Format: | Patent |
Sprache: | chi ; eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | The utility model discloses an it is heat sink to receive composite construction surface a little for high thermal current density's heat dissipation problem is solved in power electronic integrated device heat transfer field. The utility model discloses an it is heat sink to receive composite construction surface a little include the microflute crowd heat sink with the nanometer coating the surface generation that the microflute crowd is heat sink the nanometer coating, the surface material that the microflute crowd is heat sink is semiconductor, glass, pottery or metal and alloy, the microflute that the microflute crowd is heat sink says that the cross section is rectangle, trapezoidal or triangle -shaped, nanometer coating material is metal, metal oxide, metal fluoride, semi conducting material or organic high polymer coating. The utility model discloses a heat transfer performance on the heat sink surface of microflute crowd is strengthened to the nanometer coating, utilizes microflute group structure's s |
---|