Electronic components's heat radiation structure generates heat

The utility model discloses an electronic components's heat radiation structure generates heat. This heat radiation structure includes metal substrate and the bottom plate that contacts with the electronic components cooling surface, metal substrate with be equipped with the thermal pad piece b...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	BAI YONGPING, LI XIAQIAN, LI WEIDONG, LI JINGBO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!