Electronic components's heat radiation structure generates heat

The utility model discloses an electronic components's heat radiation structure generates heat. This heat radiation structure includes metal substrate and the bottom plate that contacts with the electronic components cooling surface, metal substrate with be equipped with the thermal pad piece between the bottom plate. The embodiment of the utility model discloses an electronic components's heat radiation structure generates heat's beneficial effect lie in: can effectively carry high heat dissipation efficiency to possess antistatic properties and insulating properties, but wide application in all kinds of powers that generate heat, the electronic components's that generates heat bonding, heat dissipation or heat transfer. 本实用新型公开了种发热电子元器件的散热结构。该散热结构包括金属基底和与电子元器件散热面接触的底板，所述金属基底与所述底板之间设有导热垫片。本实用新型的实施例公开的发热电子元器件的散热结构的有益效果在于：可有效提高散热效率，并且具备抗静电性及绝缘性能，可广泛应用于各类发热电源、发热电子元器件的粘接、散热或热量传递。