Conduction cooling high power semiconductor laser

The utility model provides a conduction cooling high power semiconductor laser, including laser chip group, anodal connecting block, negative pole connecting block and T type thermal insulation piece. Laser chip group is formed by a plurality of laser chip and folds a battle array module, its two outer terminal surfaces that pile up the orientation be respectively laser chip group just, the negative pole holds, the medial surface that just, the negative pole connecting block is relative has first boss and second boss respectively, first boss and second boss are the L type, and both are the central symmetry setting, the heat sink of laser instrument is regarded as jointly to first boss and second boss, two terminal surfaces of L type length portion and the vertical stroke of thermal insulation piece paste mutually and weld, L type weak point portion for the orifice plate form as extraction electrode, just, two terminal surfaces playing face and thermal insulation piece transverse part of the nonconvex on the r