High light efficiency LED packaging structure

The utility model discloses a high light efficiency LED packaging structure, including chip, base plate, reflection cup and be used for the epoxy layer of sealed reflection cup, the bottom of reflection cup is located to the chip, the bottom and the substrate connection of reflection cup, the reflec...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	YANG LIBEI, TAN HANHONG, LIU YONGQIU, YAN QIYAN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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