High light efficiency LED packaging structure

The utility model discloses a high light efficiency LED packaging structure, including chip, base plate, reflection cup and be used for the epoxy layer of sealed reflection cup, the bottom of reflection cup is located to the chip, the bottom and the substrate connection of reflection cup, the reflection cup is equipped with a plurality of irreflexive beads of photo genesis that are sent by the chip that are used for making, the top on epoxy layer is equipped with phosphor powder, after light is sent in chip work, because being equipped with a plurality of light that make, the reflection cup produces irreflexive bead for at the during operation, lightmap can produce multiple reflection on the reflection cup, and can produce even luminous effect after multiple reflection's light jets out, through with the top of phosphor powder setting on the epoxy layer, LED's thermal diffusivity can have been improved effectively to LED's luminous efficacy has been increased. 本实用新型公开了种高光效LED封装结构，包括有芯片、基板、反射杯以及用于密封反射杯的环氧树脂层；所述