Use thermal -insulated 3D scan module packaging structure of physical method

The utility model discloses an use the thermal -insulated 3D scan module packaging structure of physical method, the technical scheme who adopts is: open a gap in module base and 45 inclined plane junctions of module base station. In this way, the utility model discloses can produce breakthrough optimization effect to whole module: first this structure can reduce the influence of the heat of laser instrument production to the mirror chip that shakes through the thermal -insulated method of physics, this structure of second can reduce to shake the mirror chip and pollute at the cull of bonding in -process, this structure of third can show and is improving whole module anti vibration, shock resistance. 本实用新型公开了种使用物理方法隔热的3D扫描模组封装结构，所采用的技术方案为：在模组基座与模组基台的45°斜面连接处开条缝隙。通过上述方式，本实用新型会对整个模组产生突破性的优化效果：第该结构可以通过物理隔热方法减小激光器产生的热量对振镜芯片的影响；第二该结构可以减小振镜芯片在粘接过程中的残胶污染；第三该结构能显著提高整个模组抗振，抗冲击能力。